Fabrication of vertical fuses from vertical fins

ABSTRACT

A vertical fuse element, including, a conductive silicide base on a surface of a substrate, and a conductive silicide pillar extending in a direction perpendicular to the surface of the substrate, where the conductive silicide pillar is on the conductive silicide base, and wherein the conductive silicide pillar includes an upper portion having a width, W 5 , a base having a width, W 6 , and a neck region having a width, W 7 , where W 7 &lt;W 5 , and W 7 ≤W 6 .

BACKGROUND Technical Field

The present invention generally relates to formation of a fuse structurefrom a vertical fin, and more particularly to vertically integratedaddressable fuse elements as part of a fuse array.

Description of the Related Art

Fuses can be used in semiconductor circuits for various purposes, forexample, redundancy circuits in memory arrays and devices, andprogramming of programmable logic arrays. Fuses have typically beenimplemented in semiconductors using polysilicon or metal as the fusematerial. A blown fuse shows a very large increase in resistance.Current to blow such fuses can be exceptionally large, andelectro-migration can cause a conductive path to be reformed across ablown metal fuse.

Field Effect Transistors (FETs) can have a variety of differentstructures, for example, FETs have been fabricated with the source,channel, and drain formed in the substrate material itself, where thecurrent flows horizontally (i.e., in the plane of the substrate), andfinFETs have been formed with the channel extending outward from thesubstrate, but where the current also flows horizontally from a sourceto a drain. The channel for the finFET can be an upright slab of thinrectangular Si, commonly referred to as the fin with a gate on the fin,as compared to a typical planar FET with a single gate parallel to theplane of the substrate. Depending on the doping of the source and drain,an n-FET or a p-FET can be formed.

SUMMARY

In accordance with an embodiment of the present invention, a verticalfuse element, including, a conductive silicide base on a surface of asubstrate, and a conductive silicide pillar extending in a directionperpendicular to the surface of the substrate, where the conductivesilicide pillar is on the conductive silicide base, and wherein theconductive silicide pillar includes an upper portion having a width, W₅,a base having a width, W₆, and a neck region having a width, W₇, whereW₇<W₅, and W₇≤W₆ is provided.

In accordance with another embodiment of the present invention, a methodof forming a vertical fuse element, including, forming a vertical fin ona substrate, forming a fin cap on the vertical fin, where the fin capcovers an upper portion of the vertical fin and leaves a lower portionof the vertical fin exposed, and reducing the width of the lower portionof the vertical fin to form a neck region between the upper portion andthe lower portion of the vertical fin is provided.

In accordance with yet another embodiment of the present invention, amethod of forming an array of vertical fuse elements on a first regionof a substrate adjacent to a second region of the substrate having finfield effect transistors, including, forming a plurality of verticalfins on the substrate; forming a blocking layer on the plurality ofvertical fins; removing a portion of the blocking layer from the firstregion of the substrate to expose one or more vertical fins on the firstregion of the substrate, where the first region is adjacent to thesecond region of the substrate having one or more vertical fins coveredby a remaining portion of the blocking layer; forming a fin cap on eachof the exposed one or more vertical fins, where a lower portion of theone or more vertical fins remains exposed after formation of the fincap(s) on each of the exposed one or more vertical fins; reacting theexposed lower portion of the one or more vertical fins to form asacrificial layer on the exposed lower portion of each of the one ormore vertical fins; and removing the sacrificial layer from the lowerportion of each of the one or more vertical fins to form a neck regionin each of the one or more vertical fins is provided.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following description will provide details of preferred embodimentswith reference to the following figures wherein:

FIG. 1 is a cross-sectional side view showing a substrate, in accordancewith an embodiment of the present invention;

FIG. 2 is a cross-sectional side view showing a fin template layerformed on the surface of the substrate, a mandrel layer formed on thefin template layer, a mandrel template layer formed on the mandrellayer, and a mandrel mask layer formed on the mandrel template layer, inaccordance with an embodiment of the present invention;

FIG. 3 is a cross-sectional side view showing a patterned mandrel masklayer on the mandrel template layer, in accordance with an embodiment ofthe present invention;

FIG. 4 is a cross-sectional side view showing a patterned mandrel masklayer on the mandrel templates and sacrificial mandrels, in accordancewith an embodiment of the present invention;

FIG. 5 is a cross-sectional side view showing a sidewall layer formed onthe mandrel templates, sacrificial mandrels, and fin template layer, inaccordance with an embodiment of the present invention;

FIG. 6 is a cross-sectional side view showing sidewalls spacers formedon opposite sides of the sacrificial mandrels, in accordance with anembodiment of the present invention;

FIG. 7 is a cross-sectional side view showing sidewall spacers formed onthe fin template layer after removal of the sacrificial mandrels, inaccordance with an embodiment of the present invention;

FIG. 8 is a cross-sectional side view showing fin templates formed onthe substrate and sidewall spacers on each fin template, in accordancewith an embodiment of the present invention;

FIG. 9 is a cross-sectional side view showing a plurality of verticalfins formed on the substrate with a fin template and a sidewall spaceron each vertical fin, in accordance with an embodiment of the presentinvention;

FIG. 10 is a cross-sectional side view showing a fin template remainingon each tapered vertical fin after removal of the sidewall spacers, inaccordance with an embodiment of the present invention;

FIG. 11 is a cross-sectional side view showing a spacer layer on thevertical fins and substrate, in accordance with an embodiment of thepresent invention;

FIG. 12 is a cross-sectional side view showing a spacer layer with areduced height exposing the fin templates and an upper portion of thevertical fins, in accordance with an embodiment of the presentinvention;

FIG. 13 is a cross-sectional side view showing a capping layer on thefin templates, and the exposed portions of the vertical fins and spacerlayer, in accordance with an embodiment of the present invention;

FIG. 14 is a cross-sectional side view showing fin caps on the upperportion of each vertical fin, in accordance with an embodiment of thepresent invention;

FIG. 15 is a cross-sectional side view showing a sacrificial layerformed on the sidewalls of each vertical fin, in accordance with anembodiment of the present invention;

FIG. 16 is a cross-sectional side view showing a thinned vertical finhave a fuse structure after removal of the sacrificial layer on thesidewalls of each vertical fin, in accordance with an embodiment of thepresent invention;

FIG. 17 is a cross-sectional side view showing thinned vertical finsafter removal of the fin cap from each vertical fin, in accordance withan embodiment of the present invention;

FIG. 18 is a cross-sectional side view showing an amalgamation layerformed on the vertical fins having a fuse structure and exposedsubstrate surface, in accordance with an embodiment of the presentinvention;

FIG. 19 is a cross-sectional side view showing the vertical finsconverted to conductive silicide pillars and a surface region of thesubstrate converted to a conductive silicide base by a heat treatment,in accordance with an embodiment of the present invention;

FIG. 20 is a cross-sectional side view showing the conductive silicidepillars on separate sections of the conductive silicide base aftermasking and removal of a portion of the silicide base, in accordancewith an embodiment of the present invention;

FIG. 21 is a cross-sectional side view showing metal electrodes formedto the separate conductive silicide base segments and the conductivesilicide pillars, in accordance with an embodiment of the presentinvention;

FIG. 22 is a top view showing exposed metal electrodes formed to theconductive silicide pillars and the separate conductive silicide baseson the substrate, in accordance with an embodiment of the presentinvention;

FIG. 23 is a top view of blocking layers formed on two regions of asubstrate and vertical fins formed on two other regions of the substrateadjacent to at least one of the regions covered by a blocking layer, inaccordance with an embodiment of the present invention; and

FIG. 24 is a top view of vertical FinFETs formed on two regions of asubstrate and fuse elements formed on two other regions of the substrateadjacent to at least one of the regions having vertical FinFETs, inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION

Principles and embodiments of the present invention relate generally toforming fuse structures during front end of line (FEOL) processingutilizing semiconductor features and process steps that can also be usedto form transistors devices. The fuse structures can be formed usingfabrication processes that are also used to form other semiconductordevices of approximately the same size on the same substrate. In variousembodiments, a vertical fin that can form a horizontal or verticalchannel of a field effect transistor (FET) can be utilized to form avertical fuse element by modifying the vertical fin's physical structureand chemical composition. The vertical fin(s) having a fuse structurecan form vertical fuse elements.

Principles and embodiments of the present invention also relatesgenerally to an array of fuse elements on a region of a substrateadjacent to a region of fin field effect transistors (FinFETS), wherethe vertical fuse elements can be electrically coupled to the FinFETS.The combination of FinFETS and fuse elements on the same substrate canprovide on-chip non-volatile memory.

Principles and embodiments of the present invention also relategenerally to an addressable array of fuse elements, where one or morefuse elements of the array may be selectively blown (i.e., form an opencircuit state), for example, to program an electrically programmableread-only memory (EPROM), or to configure circuits and/or programfunctionality into an application specific integrated circuit (ASIC), orto electrically decouple portions of memory identified as bad sectorsfrom a memory circuit.

Blowing a fuse element can cause an associated memory bit to read as a‘0’.

Exemplary applications/uses to which the present invention can beapplied include, but are not limited to: non-volatile memory, including,electrically programmable read-only memory (EPROM), field programmableread-only memory (FPROM), application specific integrated circuits(ASICs), and as a fingerprinting feature of a device. The fuse elementsand/or array of fuse elements can be implemented to form a predeterminedpattern of open and closed electrical paths that can uniquely identify adevice, a portion or a device, or a function of a device, where thepattern of blown and unblown fuses can function as an electrical ordigital fingerprint (e.g., a group of parallel voltages/currents or asequence of “1”s and “0”s). The fingerprint may be used for theftprevention and identification.

In various embodiments, the materials and layers can be deposited byphysical vapor deposition (PVD), chemical vapor deposition (CVD), atomiclayer deposition (ALD), molecular beam epitaxy (MBE), or any of thevarious modifications thereof, for example, plasma-enhanced chemicalvapor deposition (PECVD), metal-organic chemical vapor deposition(MOCVD), low pressure chemical vapor deposition (LPCVD), electron-beamphysical vapor deposition (EB-PVD), and plasma-enhanced atomic layerdeposition (PEALD). The depositions can be epitaxial processes, and thedeposited material can be crystalline. In various embodiments, formationof a layer can be by one or more deposition processes, where, forexample, a conformal layer may be formed by a first process (e.g., ALD,PEALD, etc.) and a fill may be formed by a second process (e.g., CVD,electrodeposition, PVD, etc.).

It is to be understood that the present invention will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps can be varied within the scope of the present invention.

It should be noted that certain features may not be shown in all figuresfor the sake of clarity. This is not intended to be interpreted as alimitation of any particular embodiment, or illustration, or scope ofthe claims.

Referring now to the drawings in which like numerals represent the sameor similar elements and initially to FIG. 1, a cross-sectional side viewof a substrate is shown, in accordance with an embodiment of the presentinvention.

In one or more embodiments, a substrate 110 can be a semiconductor or aninsulator with an active surface semiconductor layer. The substrate caninclude crystalline, semi-crystalline, microcrystalline, or amorphousregions. The substrate can be essentially (i.e., except forcontaminants) a single element (e.g., silicon), primarily (i.e., withdoping) of a single element, for example, silicon (Si) or germanium(Ge), or the substrate can include a compound, for example, Al₂O₃, SiO₂,GaAs, SiC, or SiGe. The substrate can also have multiple materiallayers, for example, a semiconductor-on-insulator substrate (SeOI), asilicon-on-insulator substrate (SOI), germanium-on-insulator substrate(GeOI), or silicon-germanium-on-insulator substrate (SGOI). Thesubstrate can also have other layers forming the substrate, includinghigh-k oxides and/or nitrides.

In one or more embodiments, the substrate 110 can be a silicon wafer. Invarious embodiments, the substrate can be a single crystal silicon (Si),silicon germanium (SiGe), or III-V semiconductor (e.g., GaAs) wafer, orhave a single crystal silicon (Si), silicon germanium (SiGe), or III-Vsemiconductor (e.g., GaAs) surface/active layer.

FIG. 2 is a cross-sectional side view showing a fin template layerformed on the surface of the substrate, a mandrel layer formed on thefin template layer, a mandrel template layer formed on the mandrellayer, and a mandrel mask layer formed on the mandrel template layer, inaccordance with an embodiment of the present invention

In one or more embodiments, a fin template layer 120 can be formed on atleast a portion of a surface of a substrate 110. In various embodiments,the fin template layer 120 can be formed on the substrate surface byCVD, PECVD, PVD, thermal growth, or combinations thereof, where the fintemplate layer 120 can be blanket deposited on the substrate.

In one or more embodiments, the fin template layer 120 can have athickness in the range of about 20 nm to about 70 nm, or in the range ofabout 20 nm to about 50 nm, or in the range of about 50 nm to about 70nm, or in the range of about 30 nm to about 60 nm, where the thicknessof the fin template layer 120 can define the height of subsequentlyformed source/drain projections. Other thicknesses are alsocontemplated.

In various embodiments, a fin template layer 120 can be a hard masklayer for masking the substrate during transfer of a vertical finpattern to the substrate 110. The fin template layer 120 can be siliconoxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), siliconcarbonitride (SiCN), silicon boronitride (SiBN), silicon borocarbide(SiBC), silicon boro carbonitride (SiBCN), boron carbide (BC), boronnitride (BN), titanium nitride (TiN), or combinations thereof, where thefin template layer 120 may include one or more layers. The fin templatelayer 120 can also act as an etch-stop layer for forming sacrificialmandrels from a mandrel layer.

In one or more embodiments, a mandrel layer 130 can be formed on atleast a portion of the fin template layer 120. In one or moreembodiments, the mandrel layer 130 can be formed by CVD, PECVD, PVD, aspin-on process, or combinations thereof, where the mandrel layer 130can be blanket deposited on the fin template layer 120.

In various embodiments, mandrel layer 130 can be a sacrificial materialthat can be easily and selectively patterned and etched. The mandrellayer 130 can be amorphous silicon (a-Si), poly-silicon (p-Si),amorphous carbon (a-C), silicon-germanium (SiGe), an organicplanarization layer (OPL), silicon oxide (SiO), silicon nitride (SiN),or suitable combinations thereof.

In one or more embodiments, a mandrel template layer 140 can be formedon the mandrel layer 130, where the mandrel template layer can be a hardmask layer.

The mandrel template layer 140 can be a silicon oxide (SiO), a siliconnitride (SiN), a silicon oxynitride (SiON), a silicon carbonitride(SiCN), a silicon boronitride (SiBN), a silicon borocarbide (SiBC), asilicon boro carbonitride (SiBCN), a boron carbide (BC), a boron nitride(BN), or combinations thereof, where the mandrel template layer 140 mayinclude one or more layers.

In one or more embodiments, a mandrel mask layer 150 can be formed onthe mandrel template layer 140, where the mandrel mask layer 150 can bea hard mask layer or soft mask layer for masking the mandrel templatelayer 140. In one or more embodiments, the mandrel mask layer 150 can bea lithographic resist material (e.g., a photo resist material, an e-beamresist material, etc.).

In one or more embodiments, the mandrel mask layer 150 can be a positiveor negative resist material, for example, Poly (methyl methacrylate)(PMMA) or SU-8, or an electron-beam (e-beam) cured material, forexample, hydrogen silsesquioxane (HSQ).

In one or more embodiments, the mandrel mask layer 150 can be formed onthe mandrel template layer 140 by a spin on process.

FIG. 3 is a cross-sectional side view showing a patterned mandrel masklayer on the mandrel template layer, in accordance with an embodiment ofthe present invention

In one or more embodiments, the mandrel mask layer 150 can be patternedand developed to form mandrel mask segments 151 on the mandrel templatelayer 140, where the mandrel mask segments 151 cover portions of themandrel template layer 140 and expose other portions of the mandreltemplate layer. The mandrel mask layer 150 can be patterned anddeveloped using processes known in the art.

In various embodiments, the pitch (i.e., center-to-center distance)between adjacent mandrel mask segments 151 can be in the range of about20 nm to about 60 nm, or in the range of about 20 nm to about 40 nm, orin the range of about 25 nm to about 30 nm, which can determine thepitch between vertical fins.

FIG. 4 is a cross-sectional side view showing a patterned mandrel masklayer on the mandrel templates and sacrificial mandrels, in accordancewith an embodiment of the present invention.

In one or more embodiments, the exposed portions of the mandrel templatelayer 140 can be removed by wet etching or by a dry plasma etch, wherethe dry plasma can be a directional reactive ion etch (RIE). Removal ofthe exposed portions of the mandrel template layer 140 can form one ormore mandrel templates 141 below the mandrel mask segments 151, andexpose underlying portions of the mandrel layer 130. The mandreltemplates 141 can be used to transfer the mandrel pattern to the mandrellayer 130.

In one or more embodiments, once the mandrel templates 141 are formed, adirectional etch (e.g., RIE) can be used to remove exposed portions ofthe mandrel layer 130 to form sacrificial mandrels 131 on the underlyingfin template layer 120. The one or more sacrificial mandrels 131 can beon the fin template layer 120, where portions of the fin template layercan be exposed between the sacrificial mandrel(s) 131.

FIG. 5 is a cross-sectional side view showing a sidewall layer formed onthe mandrel templates, sacrificial mandrels, and fin template layer, inaccordance with an embodiment of the present invention.

In one or more embodiments, the mandrel mask segments 151 can be removedto expose the mandrel templates 141 using a process known in the art(e.g., stripping or ashing).

In one or more embodiments, a sidewall spacer layer 160 can be formed onthe exposed surfaces of the mandrel templates 141 and sacrificialmandrels 131, where the sidewall spacer layer 160 can be formed by aconformal deposition, for example, ALD or PEALD, to control thethickness of the sidewall spacer layer 160. Sidewall spacer(s) with agreater or lesser thickness can also be formed and used.

In various embodiments, the sidewall spacer layer 160 can have athickness in the range of about 4 nm to about 20 nm, or in the range ofabout 6 nm to about 15 nm, or in the range of about 8 nm to about 12 nm,where the thickness of the spacer layer can determine the pitch and/orwidth of subsequently formed vertical fins. A sidewall spacer layer withgreater thicknesses or lesser thicknesses are also contemplated.

In various embodiments, the sidewall spacer layer 160 can be siliconoxide (SiO), silicon nitride (SiN), silicon oxynitride (SiON), orcombinations thereof.

FIG. 6 is a cross-sectional side view showing sidewalls spacers formedon opposite sides of the sacrificial mandrels, in accordance with anembodiment of the present invention.

In one or more embodiments, a portion of the sidewall spacer layer 160on the fin template layer 120 and the top surfaces of the mandreltemplates 141 can be removed by an etch-back process using a directionaletch, for example, RIE, to remove the portion of the sidewall spacerlayer on surfaces approximately perpendicular to the incident ion beam,while the sidewall spacer layer 160 on the vertical sidewalls of thesacrificial mandrels 131 remain essentially unetched. In one or moreembodiments, a portion of the sidewall spacer layer 160 on the topsurfaces of the mandrel templates 141 can be removed by achemical-mechanical polishing (CMP) to expose the underlying mandreltemplates 141. The remaining portion of the sidewall spacer layer 160 onthe sacrificial mandrels 131 can form sidewall spacers 161.

In various embodiments, a plurality of vertical fins can be formed by asidewall image transfer (SIT) process, self-aligned double patterning(SADP), or self-aligned quadruple patterning (SAQP) to provide a tightpitch between vertical fins. In various embodiments, a direct print canbe used to provide fins with a looser pitch.

FIG. 7 is a cross-sectional side view showing sidewall spacers formed onthe fin template layer after removal of the sacrificial mandrels, inaccordance with an embodiment of the present invention.

In one or more embodiments, the mandrel templates 141 and sacrificialmandrels 131 can be removed after the sidewalls spacers 161 are formed,where the mandrel templates 141 and sacrificial mandrels 131 can beremoved by selective etching (e.g., RIE or wet etch). The mandreltemplates 141 and sacrificial mandrels 131 can be selectively removed,while the sidewalls spacers 161 remain on the fin template layer 120forming a fin pattern. The sidewalls spacers 161 can be made of adifferent material from the mandrel templates 141 and sacrificialmandrels 131, so the mandrel templates 141 and sacrificial mandrels 131can be selectively removed.

FIG. 8 is a cross-sectional side view showing fin templates formed onthe substrate and sidewall spacers on each fin template, in accordancewith an embodiment of the present invention;

In one or more embodiments, the fin pattern formed by the sidewallsspacers 161 can be transferred to the fin template layer 120 by removingthe exposed portion of the fin template layer 120. In variousembodiments, a portion of the fin template layer 120 can be removed toform a fin template 121 below each of the one or more sidewall spacers161 by a directional RIE. Removal of the portions of the fin templatelayer 120 can expose portions of the underlying substrate 110,surface/active layer(s), or source/drain layer(s) between each of thesidewall spacers 161 and fin templates 121.

FIG. 9 is a cross-sectional side view showing a plurality of verticalfins formed on the substrate with a fin template and a sidewall spaceron each vertical fin, in accordance with an embodiment of the presentinvention.

In one or more embodiments, one or more vertical fin(s) 111 can beformed on the substrate 110 or a surface active layer, where thevertical fin(s) 111 can be formed by removing a portion of the substrate110 between and/or around a sidewall spacer 161 and fin template 121.The one or more vertical fin(s) 111 can be formed by a directional etch,for example, a reactive ion etch (RIE) that removes the portion of thesubstrate or surface active layer not covered by a sidewall spacer 161.The removal of the substrate material can form vertical fin(s) 111 witha tapered profile having a greater width at the base of the verticalfin(s) and a narrower width at the top of the fin(s), or with a straightprofile (i.e., an essentially uniform width), where the straight ortapered profile can be produced as an aspect of the etching process.

In various embodiments, the substrate 110 or active surface layer can bea silicon-germanium (SiGe) layer and silicon fins can be epitaxiallygrown on the SiGe surface to provide strained vertical fins for at leasta portion of the formed vertical fins 111.

In one or more embodiments, trenches can be formed in the substrate orsurface active layer between and/or around a sidewall spacer 161 and fintemplate 121 to a depth, D₁, in the range of about 20 nm to about 150nm, or in the range of about 30 nm to about 100 nm, or about 45 nm toabout 60 nm, where the vertical fin(s) 111 formed in the substrate canhave a resulting height, H₁, equal to the depth of the trench. Otherdepths and heights are also contemplated. The formed vertical fin(s) 111can have a tapered profile with a width at the base 112 greater than thewidth of the sidewall spacer 161 and fin template 121 on the top surface113 of the vertical fin(s), or the etching process can be controlled toprovide vertical fin(s) 111 with essentially vertical sidewalls, suchthat the vertical fin width is substantially uniform along the finheight.

In non-limiting exemplary embodiments, the substrate 110 can be a singlecrystal silicon (Si) wafer or a single crystal silicon-germanium(Si_(x)Ge_(y)) wafer, or the substrate can include a single crystalsilicon (Si) or single crystal silicon-germanium active layer(Si_(x)Ge_(y)) at the surface of the substrate 110 (i.e., surface activelayer) from which a plurality of vertical fins can be formed.

In one or more embodiments, the vertical fin(s) 111 can have a length inthe range of about 20 nm to about 60 nm, or about 30 nm to about 50 nm,where the vertical fin length can be equal to or greater than the width,W₁. The vertical fin(s) 111 can have a substantially (e.g., with roundededges and rough/uneven surfaces) square or rectangular cross-sectionparallel with the plane of the substrate 110. In one or moreembodiments, the vertical fin(s) 111 can have a height in the range ofabout 20 nm to about 150 nm, or in the range of about 30 nm to about 100nm, or about 45 nm to about 60 nm, although other heights arecontemplated.

In one or more embodiments, the height of the vertical fin(s) 111 on afirst region of the substrate can be the same as the height of thevertical fin(s) 111 on a second region of the substrate that can beadjacent to the first region of the substrate. The vertical fin(s) 111on the second region of the substrate can be longer than the verticalfin(s) on a first region. The vertical fin(s) 111 on a second region ofthe substrate may be covered with a protective blocking layer, whilevertical fin(s) 111 on a first region of the substrate are processed toform vertical fuses. The vertical fin(s) 111 on the second region of thesubstrate may be used to fabricate one or more vertical transport finfield effect transistors (VT FinFETs). The VT FinFETs may beelectrically coupled to one or more vertical fuses on the first regionof the substrate or another adjacent region of the substrate. Aplurality of vertical fuses on a first region of the substrate 110 canform a vertically integrated front end of line (FEOL) fuse array.

FIG. 10 is a cross-sectional side view showing a fin template remainingon each tapered vertical fin after removal of the sidewall spacers, inaccordance with an embodiment of the present invention.

In one or more embodiments, the sidewall spacers 161 can be removed fromthe vertical fins 111 to expose the top surface of the fin templates 121on the vertical fins. The vertical fins 111 can have tapered sidewallprofiles, where the base 112 of a vertical fin 111 has a greater width,W₂, than the width, W₁, at the top surface 113 of the vertical fin 111.The sidewall spacers 161 can be removed, for example, by an isotropicdry etch, a selective RIE process, or a selective wet etch. Theunderlying fin template(s) 121 can act as an etch stop. The fintemplate(s) 121 can remain on the vertical fin(s) 111 after the sidewallspacers 161 are removed, and be removed by a separate selective etch.

In one or more embodiments, the width, W₁, at the top surface 113 of thevertical fin can be in the range of 10 nm to about 40 nm, and the width,W₂, at the base 112 of the vertical fin can be about 5 nm to about 40 nmwider than the width, W₁. In other embodiments, the width, W₁, at thetop surface 113 of the vertical fin(s) 111 can be about the same as thewidth, W₂, at the base 112 of the vertical fin(s) with a verticalsidewall.

In various embodiments, a plurality of vertical fins 111 formed on thesubstrate 110 can be divided into two or more subsets where a firstsubset of vertical fins includes one or more vertical fins on a firstregion of the substrate, and a second subset of vertical fins includesone or more vertical fins of the plurality of vertical fins 111 on asecond region of the substrate.

FIG. 11 is a cross-sectional side view showing a spacer layer on thevertical fins and substrate, in accordance with an embodiment of thepresent invention.

In one or more embodiments, a spacer layer 170 can be formed on the fintemplates, vertical fin(s) 111, and exposed surface of the substrate,where the spacer layer 170 can be blanket deposited on the verticalfin(s) 111 and substrate, for example, by CVD, PECVD, LPCVD, a spin-onprocess, or combinations thereof. The spacer layer 170 may fill thespaces between adjacent vertical fins 111, extend above, and cover thetop surfaces of the fin templates and sidewalls of the vertical fins.

In one or more embodiments, the spacer layer 170 can be a silicon oxide,a carbon-doped silicon oxide, a porous silicon oxide, a silicon nitride,a silicon oxynitride, or combinations thereof.

In one or more embodiments, a masking layer can be formed on at least aportion of the spacer layer 170, where the masking layer can cover oneor more of the fin templates 121 and vertical fins in a second region ofthe substrate to act as a blocking layer. The masking layer can belocated on at least a portion of the spacer layer 170, where at leastthe top surface of one or more fin templates is exposed in a firstregion of the substrate. The masking layer can be an organic lithographymaterial that can be patterned and developed. The masking layer can be apositive or negative resist material.

FIG. 12 is a cross-sectional side view showing a spacer layer with areduced height exposing the fin templates and an upper portion of thevertical fins, in accordance with an embodiment of the presentinvention.

In one or more embodiments, the height of the spacer layer 170 can bereduced to below the top surface 113 of the vertical fin(s) 111, wherethe spacer layer 170 can be reduced within a first region of thesubstrate. A chemical-mechanical polishing can be used to remove theportion of the spacer layer 170 extending above the fin templates(s)121, and a selective and/or directional etch (e.g., RIE, wet etch) canbe used to remove additional material of the spacer layer 170 to reducethe height of the spacer layer below the top surface 113 of the verticalfin(s) 111.

In one or more embodiments, the height of the spacer layer 170 can bereduced to expose about an upper ⅓ portion (e.g., 30% to 37%) of thevertical fin height, while about a lower ⅔ portion of the vertical finheight remains covered by the spacer layer. In various embodiments, thespacer layer 170 can cover about 60% to about 70% of the height of thevertical fin(s) 111, while about 30% to about 40% of the upper portionof the vertical fin 111 is exposed.

In one or more embodiments, the upper portion of the vertical fin canhave a height, H₂, above the surface of the spacer layer 170 in therange of about 5 nm to about 25 nm, or in the range of about 10 nm toabout 15 nm, although other heights are contemplated.

In one or more embodiments, the vertical fins 111 can be a crystallinesemiconductor with a predetermined crystal orientation, where removal ofthe one or more exposed fin templates 121 exposes a crystalline surface.

FIG. 13 is a cross-sectional side view showing a capping layer on thefin templates, and the exposed portions of the vertical fins and spacerlayer, in accordance with an embodiment of the present invention.

In one or more embodiments, a capping layer 180 can be formed on theexposed surfaces of the vertical fin(s) 111, fin template(s) 121, andspacer layer 170, where the capping layer 180 can be formed by ALD,PEALD, CVD, PECVD, or combinations thereof.

In various embodiments, a vertical fin 111 can be encapsulated by thefin template 121 on a top surface 113 and the capping layer 180 on theside and end surfaces of the vertical fins, where the capping layer isdeposited on the exposed surfaces of the vertical fin 111, fin template121, and spacer layer 170. The height of the fin template 121 can begreater than the thickness of the capping layer 180.

In one or more embodiments, the capping layer 180 can be silicon oxide(SiO), silicon nitride (SiN), silicon oxynitride (SiON), siliconcarbonitride (SiCN), silicon boronitride (SiBN), silicon borocarbide(SiBC), silicon boro carbonitride (SiBCN), boron carbide (BC), a boronnitride (BN), or combinations thereof. In various embodiments, the fintemplate 121 and the capping layer 180 may be the same material, suchthat both the fin template 121 and the capping layer 180 have the sameetch rate. The fin template 121 and the capping layer 180 may be made ofmaterials that block oxygen diffusion (e.g., Si₃N₄) to avoid formationof a silicon oxide.

FIG. 14 is a cross-sectional side view showing fin caps on the upperportion of each vertical fin, in accordance with an embodiment of thepresent invention.

In one or more embodiments, a portion of the capping layer 180 can beremoved to form fin cap(s) 181 on each of the vertical fin(s) 111, wherethe fin cap(s) 181 can include the fin template 121 and remainingportion of the capping layer 180 that covers the upper portion of eachvertical fin 111. The capping layer 180 can be removed from thehorizontal surfaces of the fin template 121 and spacer layer 170 througha selective, direction etch (e.g., RIE), where the exposed capping layer180 material can be etched back to expose the underlying surfaces. Thecombination of the fin template 121 and remaining capping layer 180 onthe fin template and side surfaces can form a fin cap 181 that coversthe portion of the vertical fin 111 above the top surface of the spacerlayer 170.

The fin template 121 and capping layer 180 can be the same material(e.g., silicon nitride (SiN)) or different materials.

In one or more embodiments, the spacer layer 170 can be removed toexpose the sidewalls of the lower portion of the vertical fin(s) 111.The spacer layer 170 can be removed using an isotropic etch selectivefor the material of the spacer layer 170.

FIG. 15 is a cross-sectional side view showing a sacrificial layerformed on the sidewalls of each vertical fin, in accordance with anembodiment of the present invention.

In one or more embodiments, a sacrificial layer 119 can be formed on theexposed sidewalls of the vertical fin(s) 111, where the formation of thesacrificial layer 119 can consume at least a portion of the vertical finbelow the fin cap 181 to reduce the width (i.e. thickness) of theinitial fin material. A portion of the exposed surface of the substrate110 can be converted to the sacrificial layer 119, where the portion canbe consumed to increase the depth of the trench adjacent to theverticals 111, and thereby increase the height of the vertical fins. Invarious embodiments, the sacrificial layer 119 can be thermally grown onthe sidewalls of the vertical fin(s) 111 and the exposed substratesurface, for example by a thermal oxide growth process. Formation of theoxide can initially increase the thickness (i.e., width) of the verticalfins 111.

In a non-limiting exemplary embodiment, a silicon dioxide (SiO₂)sacrificial layer 119 can be grown on the sidewalls by consuming asurface portion of crystalline silicon (c-Si) vertical fin(s) 111, wherethe silicon dioxide (SiO₂) sacrificial layer 119 can be formed bythermal oxidation of the exposed vertical fin material. Formation of thesacrificial layer 119 can increase the width of the vertical fin 111below the fin cap. The remaining width of a silicon vertical fin 111 canbe less than the initial width after formation of the silicon dioxidesacrificial layer 119 due to conversion of an outer layer of the exposedvertical fin to the silicon dioxide (SiO₂).

FIG. 16 is a cross-sectional side view showing a thinned vertical finhave a fuse structure after removal of the sacrificial layer on thesidewalls of each vertical fin, in accordance with an embodiment of thepresent invention.

In one or more embodiments, the sacrificial layer 119 can be removed toreduce the width of the vertical fin(s) 111 to provide a narrowervertical fin having a base with a reduced width, W₃, and a neck region115, where the neck region 115 has a width, W₄, less than the width, W₁,of the top surface 113 and reduced width, W₃, of the base 112 of thevertical fin 111. Removal of the sacrificial layer 119 below the upperportion 117 of the vertical fin(s) 111 can reduce the cross-sectionalarea of the lower portion of the vertical fin(s) 111. In variousembodiments, the width, W₄, of the neck region 115 is less than both thereduced width, W₃, of the base 112 and the width, W₁, of the top surface113. In various embodiments, the upper portion 117 of the verticalfin(s) 111 can have straight sidewalls instead of tapered sidewalls dueto the fin forming process, such that the width, W₁, is essentiallyuniform for the upper portion 117.

In embodiments with a vertical fin 111 having straight sidewalls and auniform width along the height of the vertical fin, the widths, W₃ andW₄, can be about the same after reduction of the vertical fin width. Theneck region 115 may be formed by undercutting the fin cap(s) 181 by theisotropic etch.

In one or more embodiments, the sacrificial layer 119 can be removedusing a selective isotropic etch (e.g., wet etch) to form a narrowersection of the vertical fin 111 that has a region (e.g., neck region115).

In one or more embodiments, the formation of the sacrificial layer 119may be skipped and the width of the vertical fin 111 reduced by anisotropic etch (e.g., isotropic wet etch, dry etch, or plasma etch) thatselectively removes material from the exposed surfaces of the verticalfin 111. The width of a lower portion of the vertical fin(s) 111 can bereduced by etching the lower portion of the vertical fin to remove apredetermined thickness from the side and end walls of the verticalfin(s).

In various embodiments, a portion of the vertical fin 111 is madenarrower to create a structural change in a conductive path thatincreases resistance across at least a portion of the conductive path toform a fuse structure. The resulting fuse structure can provide an opencircuit state or a closed circuit state depending on whether theconductive path through the fuse structure is interrupted oruninterrupted, respectively. The vertical fin having a fuse structurecan form a fuse element in a circuit, where a fuse element has a fusestructure. The fuse element can be converted from a closed circuit stateto and open circuit state by passing a sufficient current through thefuse structure at least momentarily to generate sufficientelectromigration to form a gap in a conductive material at the neckregion 115. A fuse element or an array of fuse elements can beprogrammed by selectively forming open circuit state(s) alongpredetermined conductive path(s) by blowing (e.g., forming a gap in theconductor or measurable increase in resistivity) a predetermined patternof fuse structures. The array of fuse elements can be addressable, soselected fuse elements can be blown, and the fuse elements can beelectrically connected to a programming device/and/or circuit that isconfigured to selectively pass sufficient current through predeterminedfuse elements to form an open circuit state. Programming fuses canutilize electromigration to form a gap in the conductive material orincrease the resistance by a predetermined measurable amount.

FIG. 17 is a cross-sectional side view showing thinned vertical finsafter removal of the fin cap from each vertical fin, in accordance withan embodiment of the present invention.

In one or more embodiments, the fin cap 181, which can include thecapping layer 180 and fin template 121, on a vertical fin 111 can beremoved by a selective isotropic etch (e.g., a wet etch). Thenon-reduced upper portion 117 of the vertical fin 111 can be exposed byremoval of the fin cap 181. Removal of the fin cap 181 from the upperportion of the vertical fin 111 can leave the entire vertical finexposed for formation of a subsequent conformal layer.

FIG. 18 is a cross-sectional side view showing an amalgamation layerformed on the vertical fins having a fuse structure and exposedsubstrate surface, in accordance with an embodiment of the presentinvention.

In one or more embodiments, an amalgamation layer 190 can be formed onthe exposed surfaces of the vertical fin(s) 111 and substrate 110, wherethe amalgamation layer 190 can be a metal that forms a silicide with thematerial of the vertical fin(s) 111. The amalgamation layer 190 can beconformally formed on the exposed surfaces of the vertical fin(s) 111and substrate 110, for example, by ALD or PEALD, such that theamalgamation layer 190 has a uniform thickness on the vertical fin(s)and substrate surface.

In one or more embodiments, the amalgamation layer 190 can be a metalthat can form a metal silicide (M-Si) with the silicon of the verticalfin(s) 111. In various embodiments, the amalgamation layer 190 can beselected from the group consisting of titanium (Ti), nickel (Ni), cobalt(Co), molybdenum (Mo), platinum (Pt), tungsten (W), tantalum (Ta), orsuitable combinations thereof.

In one or more embodiments, the amalgamation layer 190 has a thicknessin the range of about 2 nm to about 30 nm, or in the range of about 3 nmto about 10 nm. The thickness of the of the amalgamation layer 190 canbe related to the width and volume of the vertical fin 111, where thethickness of the amalgamation layer 190 can be sufficient to convert theentire volume of a vertical fin 111 to a silicide or only a portion ofthe vertical fin 111 to a silicide.

FIG. 19 is a cross-sectional side view showing the vertical finsconverted to conductive silicide pillars and a surface region of thesubstrate converted to a conductive silicide base by a heat treatment,in accordance with an embodiment of the present invention.

In one or more embodiments, the amalgamation layer 190, vertical fin(s)111, and substrate 110 can be heat treated to allow the materials of theamalgamation layer 190, vertical fin(s) 111, and substrate surface tointer-diffuse. The amalgamation layer 190 can react with the verticalfin(s) 111 and substrate 110 to convert the neighboring portion of thevertical fin(s) into conductive silicide pillar(s) 201 and theneighboring portion of the substrate into a conductive silicide base202, where the amalgamation layer 190 can be a silicide-forming metallayer. Unreacted portions of the amalgamation layer 190 can beselectively removed after the silicide formation, where the unreactedportions can be removed by a selective etch. In various embodiments, theentire vertical fin 111 can be converted into a metal silicide. Invarious embodiments, only an outer shell 208 of the vertical fin 111 maybe converted into a metal silicide, where the conductive silicidepillar(s) 201 can include a remaining fin core 209 of the vertical finmaterial. The conductive silicide pillar(s) 201 can retain the fusestructure previously formed in the vertical fin(s) 111, including apillar neck region 205. The narrow pillar neck region 205 functions as afuse portion. The wider regions 206 and 207 function as the anode andcathode of the fuse. When applying a voltage bias between the anode andthe cathode to cause a current to flow from the anode, through the fuseportion, to the cathode, the narrow neck region 205 increases currentdensity, thus increasing the electromigration. By reducing the width ofthe electromigrated region in the fuse portion (neck region), thecurrent density and the temperature increases in the electromigratedregion during electrical programming of the fuse (i.e., opening thecircuit).

In one or more embodiments, the reaction of the amalgamation layer 190with the vertical fin(s) 111 and substrate surface can alter the widthof the vertical fin(s) 111 due to incorporation of the amalgamationlayer material, while retaining the fuse structure. In variousembodiments, the conductive silicide pillar(s) 201 can have an upperportion 207 with a width, W₅, which can be larger than the originalwidth, W₁, of the vertical fin; a neck region 205 with a width, W₇,which can be wider than original width, W₄; and a base region 206 with awidth, W₆, which can be wider than the original width W₃. In variousembodiments, W₇<W₅, and W₇≤W₆, where the sidewalls of the conductivesilicide pillar(s) 201 can be straight or tapered.

In one or more embodiments, the width, W₅, of the upper portion 207 ofthe conductive silicide pillar 201 can be in the range of about 10 nm toabout 60 nm, and the width, W₇, of the neck region 205 of the conductivesilicide pillar is less than the width, W₅, of the upper portion 207 ofthe conductive silicide pillar by about 5 nm to about 40 nm. In variousembodiments, the conductive silicide pillar 201 can have a height in therange of about 20 nm to about 150 nm, or in the range of about 30 nm toabout 100 nm, or about 45 nm to about 60 nm.

In one or more embodiments, the conductive silicide base 202 can have athickness (i.e., depth) greater than the width, W₇, of the pillar neckregion 205, where the material of the amalgamation layer 190 may diffuseto a depth greater than the width, W₇, during a heat treatment. Theconductive silicide base 202 can have a thickness greater than thewidth, W₇, such that the pillar neck region 205 is the narrowest regionthrough which current flowing through a fuse element passes.

In one or more embodiments, at least a portion of the conductivesilicide pillar(s) 201 and conductive silicide base 202 can be titaniumsilicide (TiSi), nickel silicide (NiSi), cobalt silicide (CoSi),molybdenum silicide (MoSi), platinum silicide (PtSi), tungsten silicide(WSi), tantalum silicide (TaSi), or suitable combinations thereof.

In one or more embodiments, the thickness of the amalgamation layer 190can be great enough to supply sufficient metal to convert the entirevertical fin 111 to a metal-silicide (M-Si) material. In variousembodiments, the amalgamation layer 190 can have a thickness less thanan amount sufficient to convert the entire vertical fin 111 to ametal-silicide material, where a fin core 209 of the vertical finmaterial can remain within the outer silicide shell 208 of theconductive silicide pillar(s) 201. The metal silicide shell 208 cansurround the fin core 209, where the fin core 209 can have a higherresistivity than the metal silicide shell 208.

In one or more embodiments, the conversion of a silicon vertical fin 111to a conductive silicide pillar 201 changes the resistivity from a rangeof about 1×10⁻⁵ Ω-m to about 0.1 Ω-m to a range of about 1×10⁻⁷ Ω-m toabout 3×10⁻⁶ Ω-m for the metal silicide.

In various embodiments, the vertical fin 111 and resulting fin core 209can be doped or undoped single crystal silicon, where the doped orundoped single crystal silicon has a higher resistivity than the metalsilicide. A doped silicon fin core 209 can be utilized to provideincreased electromigration of a metal-silicide shell 208. A current canpass through a silicide outer shell 208 resulting in electromigration ofthe silicide, whereas the fin core 209 can remain, but has a measurablyhigher resistance than the silicide outer shell 208. A gap can form inthe outer shell 208 causing a drop in current flow. In variousembodiments, the difference in resistance between the silicide outershell 208 and the fin core 209 can be at least 10%.

In one or more embodiments, the conductive silicide pillar(s) 201 canhave a pillar neck region 205 that is narrower than the width of anupper portion 207 of the conductive silicide pillar(s) 201, as measuredat a cross-section parallel with the plane of the substrate. The base206 of the conductive silicide pillar 201 can be in contact with theconductive silicide base 202, and an upper portion 207 can be at thedistal end of the conductive silicide pillar 201 away from theconductive silicide base 202. The metal silicide shell 208 can surroundthe fin core 209 and form an electrical path having a lower resistancethan the material of the vertical fin 111 from the upper portion 207,through the pillar neck region 205, to the conductive silicide base 202or conductive silicide base segments 204.

In a non-limiting exemplary embodiment, the amalgamation layer 190 is anickel (Ni) layer deposited on the exposed surfaces of the substrate 110and vertical fin(s) 111 to a thickness of 5 nm, where the upper portion117 of the vertical fin has a width, W₁, of about 20 nm, the neck region115 has a width, W₄, of about 8 nm, and the base 112 of the vertical finhas a width, W₃, of about 20 nm. After reacting the amalgamation layer190 with the vertical fin(s) 111 and substrate 110, to form a conductivesilicide base 202 and conductive silicide pillar(s) 201, the conductivesilicide pillar(s) 201 can have an upper portion 207 with a width, W₅,of about 30 nm, a neck region 205 with a width, W₇, of about 18 nm, anda base region 206 with a width, W₆, of about 30 nm. A silicide thicknessof about 2.2 times the initial amalgamation layer thickness can beformed if the metal of the amalgamation layer is fully converted intothe metal silicide. The final thickness (NiSi shell plus fin core) willincrease by an amount of reacted Ni thickness. For example, the 5 nmthick amalgamation layer 190 on each sidewall can produce an 11 nm thickNiSi layer on each side of the vertical fin 111, while about 5 nm of Siis incorporated. In another example, 2 nm of Ni is converted to ˜4.4 nmNiSi, then the total width increase will be about 4 nm. Note that forother metal silicides, the thickness ratio (e.g., 2.2) between silicideand metal can change, which can result in different final thicknessesfrom the same amalgamation layer thickness depending on the metal of theamalgamation layer 190.

In one or more embodiments, the heat treatment can be a furnace anneal,a rapid thermal anneal (RTA), a flash anneal, or any other suitableannealing technique, at a temperature in the range of about 350° C. toabout 850° C. for a duration in the range of about 0.001 min. to about60 min., where the duration of the heat treatment can be shorter forhigher temperatures.

FIG. 20 is a cross-sectional side view showing the conductive silicidepillars on separate sections of the conductive silicide base aftermasking and removal of a portion of the silicide base, in accordancewith an embodiment of the present invention.

In one or more embodiments, the conductive silicide pillar(s) 201 can becovered by a temporary fill layer 210 and a masking layer 215, where thetemporary fill layer 210 can be a flowable oxide or polymeric material,and the masking layer 215 can be an organic resist material, as would beknown in the art. The temporary fill layer 210 and a masking layer 215can be blanket deposited on the conductive silicide pillar(s) 201 andconductive silicide base 202, where the temporary fill layer 210 canfill the space between conductive silicide pillars 201.

In one or more embodiments, the masking layer 215 can be patterned anddeveloped to expose predetermined portions of the temporary fill layer210, where the exposed portions can be between predetermined conductivesilicide pillar(s) 201, and may include one or more conductive silicidepillar(s) 201. The exposed portion(s) of the temporary fill layer 210can be removed, for example, by a directional selective etch (e.g., RIE)that exposes the underlying portion of the conductive silicide base 202.The exposed portion(s) of the temporary fill layer 210 can be removed,for example, by a directional selective etch (e.g., RIE) that separatesthe conductive silicide base 202 into two or more conductive silicidebase segments 204.

In one or more embodiments, the exposed conductive silicide pillar(s)201 and conductive silicide base 202 can be removed to separate theconductive silicide base 202 into two or more conductive silicide basesegments 204. In various embodiments, a single conductive silicidepillar 201 can be on a conductive silicide base segment 204, or aplurality of conductive silicide pillars 201 can be on a conductivesilicide base segment 204. The conductive silicide pillars 201 can beganged together to form multiple fuse elements in parallel to increasethe current carrying capacity of the ganged fuse element. Adjusting thenumber of conductive silicide pillars 201 on a conductive silicide basesegment 204 can vary the current used to blow the ganged fuse element,where the current carrying capacity of each individual conductivesilicide pillars 201 remains the same.

In one or more embodiments, a conductive silicide pillar 201 can be oneach conductive silicide base segment 204, where the base region 206 ofthe conductive silicide pillar 201 can be in contact with the conductivesilicide base segment 204. Each conductive silicide base segment 204 canprovide an electrical path to a proximal end of one or more conductivesilicide pillar(s) 201. Current can flow vertically from the conductivesilicide base segment 204 through the one or more conductive silicidepillar(s) 201 in electrical contact with the conductive silicide basesegment 204, or vertically through the upper portion 207 of theconductive silicide pillar(s) 201 and pillar neck region 205 to theconductive silicide base segment 204. In various embodiments, theconductive silicide base segment 204 can have a lower resistance thanthe one or more conductive silicide pillar(s) 201 to conduct current toeach conductive silicide pillar 201.

FIG. 21 is a cross-sectional side view showing metal electrodes formedto the separate conductive silicide base segments and the conductivesilicide pillars, in accordance with an embodiment of the presentinvention.

In one or more embodiments, the masking layer 215 and temporary filllayer 210 can be removed to expose the conductive silicide pillar(s) 201on the separate silicide base segments 204, and intervening portions ofthe underlying substrate 110 using methods known in the art (e.g.,stripping, ashing, etching, etc.).

In one or more embodiments, an interlayer dielectric (ILD) layer 220 canbe formed on the exposed conductive silicide pillar(s) 201, separatesilicide base segments 204, and intervening portions of the underlyingsubstrate 110, where the interlayer dielectric (ILD) layer 220 can beblanket deposited to fill in the spaces between conductive silicidepillars and silicide base segments 204.

In one or more embodiments, the ILD layer 220 can be silicon oxide(SiO), a low-k dielectric, a flowable polymeric material, or acombination thereof. A low-k dielectric material can include, but not belimited to, a fluoride-doped silicon oxide (e.g., fluoride doped glass),a carbon doped silicon oxide, a porous silicon oxide, a spin-on siliconbased polymeric material (e.g., tetraethyl orthosilicate (TEOS),hydrogen silsesquioxane (HSQ) and methylsilsesquioxane (MSQ)), orcombinations thereof. In various embodiments, the ILD layer 220 can beformed by CVD, LPCVD, or spun on.

In one or more embodiments, the ILD layer 220 can cover the conductivesilicide pillar(s) 201 and extend above the top surfaces of theconductive silicide pillar(s) 201. A chemical-mechanical polishing canbe utilized to remove the ILD layer material above the top surfaces ofthe conductive silicide pillar(s) 201, and provide a smooth, flatsurface.

In one or more embodiments, the ILD layer 220 can be masked, and viasformed in the ILD layer down to the conductive silicide pillar(s) 201and silicide base segments 204 to form electrical paths. The electricalpath can include the conductive silicide base 202 or conductive silicidebase segments 204 and conductive silicide pillar(s) 201 having the fusestructure that forms a fuse element.

In one or more embodiments, the vias in the ILD layer 220 can be filledwith a conductive metal to form a metal electrode(s) 231, 235 in contactwith the conductive silicide base 202, conductive silicide base segments204, and conductive silicide pillar(s) 201. The metal electrode 235 tothe upper portion of the conductive silicide pillar 201 can have asmaller cross-sectional area than the metal electrode 231 to theconductive silicide base 202 or conductive silicide base segments 204,since each fuse element may carry a smaller individual current than thecurrent that passes through the conductive silicide base 202 orconductive silicide base segments 204. The metal electrode 235 to theupper portion 207 of the conductive silicide pillar 201 can have alarger cross-sectional area than the pillar neck region 205, so thepillar neck region 205 experiences the largest current density, and thecontact between the metal electrode 235 and upper portion 207 does notrestrict current flow.

In one or more embodiments, the material of the metal electrode(s) 231,235 is selected from the group consisting of tungsten (W), cobalt (Co),titanium (Ti), molybdenum (Mo), nickel (Ni), copper (Cu), and suitablecombinations thereof.

While not intending to be limited by theory, it is believed that currentflowing through the fuse element with a sufficient current density cancause electromigration of the silicide material, where theelectromigration can be predominantly at the pillar neck region 205. Thecurrent density can provide sufficient electromigration of the metalsilicide of to migrate away from this narrow region of the fusestructure until an open circuit is created, for example, by a gap beingformed between the metal silicide of the upper portion 207 of theconductive silicide pillar(s) 201 and the lower portion. In variousembodiments, a fin core 209 can remain, but the fin core can have ameasurably greater resistance than the conductive metal-silicide formingan outer metal-silicide shell 208. In various embodiments, the currentdensity passed through a fuse element can be sufficient to causeelectromigration of the metal-silicide material to create a measurableincrease in resistivity.

In various embodiments, a change in resistance in the range of at leastabout 10% can be measured to determine the opening of a fuse element. Invarious embodiments, the change in resistance can be in the range ofabout 10% to about 100%. In various embodiments, a blown fuse elementcan have a resistance of 1000Ω or more.

FIG. 22 is a top view showing exposed metal electrodes formed to theconductive silicide pillars and the separate conductive silicide baseson the substrate, in accordance with an embodiment of the presentinvention.

In one or more embodiments, the metal electrode(s) 231, 235 can beformed in the ILD layer 220 to provide conductive electrical paths toeach of the fuse elements 200, including a conductive silicide pillar(s)201 having a fuse structure, such that the conductive silicide pillar201 can be blown (i.e., form an open circuit or measurable increase inresistivity) by selectively passing a current through the specificconductive silicide pillar 201. In various embodiments, each conductivesilicide pillar 201 can be electrically coupled to ground though aprogramming circuit. The metal electrode 231 can be configured anddimensioned to carry a larger current than metal electrode 235.

FIG. 23 is a top view of blocking layers formed on two regions of asubstrate and vertical fins formed on two other regions of the substrateadjacent to at least one of the regions covered by a blocking layer, inaccordance with an embodiment of the present invention.

In one or more embodiments, a plurality of vertical fins 111 can beformed on the substrate 110, where the vertical fins 111 can be arrangedas an array (e.g., a row×column array) that can be separated into two ormore regions on the substrate.

In one or more embodiments, a spacer layer 170 and a masking layer canbe formed on at least a portion of the substrate 110 and vertical fins111 to form a blocking layer 330. One or more sections of the blockinglayer 330 can be removed to expose the underlying vertical fins 111 in afirst region 310 for forming a fuse structure and fuse element, whileother vertical fins 111 in a neighboring second region 320 remainscovered by the blocking layer 330.

In various embodiments, the blocking layer 330 can be patterned to forman arrangement of vertical transport fin field effect transistors onpredetermined portions of the substrate 110 and fuse arrays on differentpredetermined portions of the substrate 110.

FIG. 24 is a top view of vertical FinFETs formed on two regions of asubstrate and fuse elements formed on two other regions of the substrateadjacent to at least one of the regions having vertical FinFETs, inaccordance with an embodiment of the present invention.

In one or more embodiments, the portions of the blocking layer 330 canbe removed from the second region 320 on the substrate to exposed thepreviously protected vertical fins 111, while a blocking layer can beformed on the conductive silicide base 202, conductive silicide basesegments 204, and conductive silicide pillar(s) 201 on the first region310 of the substrate.

In various embodiments, additional front-end fabrication processes canbe utilized to fabricate one or more FinFETS 400 from the previouslycovered vertical fins 111, where the FinFETS 400 are on the secondregion(s) 320 of the substrate adjacent to the first regions 310. Thevertical finFETS can be n-type FinFETs, p-type FinFETs, or a combinationthereof to form CMOS devices. The FinFET can have current flowvertically or horizontally, such that the FinFETs are vertical orhorizontal transport FinFETs. The FinFETs can be part of the programmingcircuit for addressing the conductive silicide pillar(s) 201, a logicdevice, memory devices, or a combination thereof. The fin field effecttransistor(s) 400 on the second region 320 of the substrate 100 can forma logic circuit, a memory circuit, or a combination thereof, and atleast one conductive silicide pillars having a fuse structure iselectrically coupled to the logic circuit, the memory circuit, or thecombination thereof.

In a non-limiting exemplary embodiment, an array of vertical fuseelements 200 can be formed on a first region 310 of a substrate 110adjacent to a second region 320 of the substrate having fin field effecttransistors 400 by forming a plurality of vertical fins 111 on thesubstrate 110; forming a blocking layer 330 on the plurality of verticalfins; removing a portion of the blocking layer 330 from a first region310 of the substrate to expose one or more vertical fins 111 on thefirst region of the substrate, where the first region 310 is adjacent toa second region 320 of the substrate 110 having one or more verticalfins covered by a remaining portion of the blocking layer 330; forming afin cap 181 on each of the exposed one or more vertical fins 111, wherea lower portion of the one or more vertical fins remains exposed afterformation of the fin cap(s) 181 on each of the exposed one or morevertical fins 111; reacting the exposed lower portion of the one or morevertical fins to form a sacrificial layer 119 on the exposed lowerportion of each of the one or more vertical fins 111; and removing thesacrificial layer 119 from the lower portion of each of the one or morevertical fins to form a neck region 115 in each of the one or morevertical fins 111.

Reference in the specification to “one embodiment” or “an embodiment”,as well as other variations thereof, means that a particular feature,structure, characteristic, and so forth described in connection with theembodiment is included in at least one embodiment. Thus, the appearancesof the phrase “in one embodiment” or “in an embodiment”, as well anyother variations, appearing in various places throughout thespecification are not necessarily all referring to the same embodiment.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements can also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements can be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The present embodiments can include a design for an integrated circuitchip, which can be created in a graphical computer programming language,and stored in a computer storage medium (such as a disk, tape, physicalhard drive, or virtual hard drive such as in a storage access network).If the designer does not fabricate chips or the photolithographic masksused to fabricate chips, the designer can transmit the resulting designby physical means (e.g., by providing a copy of the storage mediumstoring the design) or electronically (e.g., through the Internet) tosuch entities, directly or indirectly. The stored design is thenconverted into the appropriate format (e.g., GDSII) for the fabricationof photolithographic masks, which typically include multiple copies ofthe chip design in question that are to be formed on a wafer. Thephotolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

Methods as described herein can be used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

It should also be understood that material compounds will be describedin terms of listed elements, e.g., SiGe. These compounds includedifferent proportions of the elements within the compound, e.g., SiGeincludes Si_(x)Ge_(1-x) where x is less than or equal to 1, etc. Inaddition, other elements can be included in the compound and stillfunction in accordance with the present principles. The compounds withadditional elements will be referred to herein as alloys.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This can be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or including, when usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above”“upper,” and the like, can be used herein for ease of description todescribe one element's or feature's relationship to another element(s)or feature(s) as illustrated in the FIGS. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the FIGS. For example, if the device in theFIGS. is turned over, elements described as “below” “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations), and the spatially relativedescriptors used herein can be interpreted accordingly. In addition, itwill also be understood that when a layer is referred to as being“between” two layers, it can be the only layer between the two layers,or one or more intervening layers can also be present.

It will be understood that, although the terms first, second, etc. canbe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element without departing from the scope of thepresent concept.

Having described preferred embodiments of a device and method (which areintended to be illustrative and not limiting), it is noted thatmodifications and variations can be made by persons skilled in the artin light of the above teachings. It is therefore to be understood thatchanges may be made in the particular embodiments disclosed which arewithin the scope of the invention as outlined by the appended claims.Having thus described aspects of the invention, with the details andparticularity required by the patent laws, what is claimed and desiredprotected by Letters Patent is set forth in the appended claims.

What is claimed is:
 1. A vertical fuse element, comprising: a conductivesilicide base on a surface of a substrate; and a conductive silicidepillar extending in a direction perpendicular to the surface of thesubstrate, where the conductive silicide pillar is on the conductivesilicide base, and wherein the conductive silicide pillar includes anupper portion having a width, W₅, a base having a width, W₆, and a neckregion having a width, W₇, where W₇<W₅, and W₇≤W₆.
 2. The vertical fuseelement of claim 1, further comprising, a first metal electrode inphysical and electrical contact with the conductive silicide base, and asecond metal electrode in physical and electrical contact with the upperportion of the conductive silicide pillar, where the material of themetal electrodes is selected from the group consisting of tungsten (W),cobalt (Co), titanium (Ti), molybdenum (Mo), nickel (Ni), copper (Cu),tantalum (Ta), ruthenium (Ru), zirconium (Zr), aluminum (Al), platinum(Pt), silver (Ag), gold (Au), tantalum nitride (TaN), titanium nitride(TiN), tantalum carbide (TaN), titanium carbide (TiC), titanium aluminumcarbide (TiAlC), and suitable combinations thereof.
 3. The vertical fuseelement of claim 1, wherein the material of the conductive silicidepillar is titanium silicide (TiSi), nickel silicide (NiSi), cobaltsilicide (CoSi), molybdenum silicide (MoSi), platinum silicide (PtSi),tungsten silicide (WSi), tantalum silicide (TaSi), or suitablecombinations thereof.
 4. The vertical fuse element of claim 1, whereinthe conductive silicide pillar includes an outer silicide shell and afin core.
 5. The vertical fuse element of claim 1, wherein the width,W₅, of the upper portion of the conductive silicide pillar is in therange of about 20 nm to about 60 nm.
 6. The vertical fuse element ofclaim 5, wherein the width, W₇, of the neck region of the conductivesilicide pillar is less than the width, W₅, of the upper portion of theconductive silicide pillar by about 5 nm to about 40 nm.
 7. The verticalfuse element of claim 5, wherein the width, W₇, of the neck region ofthe conductive silicide pillar is in the range of about 5 nm to about 15nm.
 8. The vertical fuse element of claim 5, wherein the conductivesilicide pillar has a height in the range of about 20 nm to about 150nm.
 9. The vertical fuse element of claim 5, wherein the conductivesilicide pillar is on a first region of the substrate adjacent to asecond region of the substrate including a vertical transport fin fieldeffect transistor.
 10. A method of forming a vertical fuse element,comprising: forming a vertical fin on a substrate; forming a fin cap onthe vertical fin, where the fin cap covers an upper portion of thevertical fin and leaves a lower portion of the vertical fin exposed; andreducing the width of the lower portion of the vertical fin to form aneck region between the upper portion and the lower portion of thevertical fin.
 11. The method of forming a vertical fuse element of claim10, further comprising, removing the fin cap from the vertical fin, andforming an amalgamation layer on the vertical fin.
 12. The method offorming a vertical fuse element of claim 11, further comprising, heattreating the amalgamation layer to form a conductive silicide pillar.13. The method of forming a vertical fuse element of claim 12, whereinthe amalgamation layer is titanium (Ti), nickel (Ni), cobalt (Co),molybdenum (Mo), platinum (Pt), tungsten (W), tantalum (Ta), or suitablecombinations thereof.
 14. The method of forming a vertical fuse elementof claim 12, further comprising reducing the width of the lower portionof the vertical fin by forming a sacrificial layer on the exposed lowerportion of the vertical fin, and removing the sacrificial layer from thelower portion of the vertical fin to form the neck region between theupper portion and the lower portion of the vertical fin; or etching thelower portion of the vertical fin to remove a predetermined thickness ofthe lower portion of the vertical fin.
 15. The method of forming avertical fuse element of claim 12, wherein the conductive silicidepillar has a resistivity in the range of about 1×10⁻⁷ Ω-m to about3×10⁻⁶ Ω-m.
 16. A method of forming an array of vertical fuse elementson a first region of a substrate adjacent to a second region of thesubstrate having fin field effect transistors, comprising: forming aplurality of vertical fins on the substrate; forming a blocking layer onthe plurality of vertical fins; removing a portion of the blocking layerfrom the first region of the substrate to expose one or more verticalfins on the first region of the substrate, where the first region isadjacent to the second region of the substrate having one or morevertical fins covered by a remaining portion of the blocking layer;forming a fin cap on each of the exposed one or more vertical fins,where a lower portion of the one or more vertical fins remains exposedafter formation of the fin cap(s) on each of the exposed one or morevertical fins; reacting the exposed lower portion of the one or morevertical fins to form a sacrificial layer on the exposed lower portionof each of the one or more vertical fins; and removing the sacrificiallayer from the lower portion of each of the one or more vertical fins toform a neck region in each of the one or more vertical fins.
 17. Themethod of forming an array of vertical fuse elements on a first regionof a substrate adjacent to a second region of the substrate having finfield effect transistors of claim 16, further comprising, removing thefin cap from each of the one or more vertical fins, and forming anamalgamation layer on each of the one or more vertical fins, and heattreating the amalgamation layer to convert each of the one or morevertical fins to a conductive silicide pillar.
 18. The method of formingan array of vertical fuse elements on a first region of a substrateadjacent to a second region of the substrate having fin field effecttransistors of claim 17, further comprising, forming a metal electrodeto each of the one or more conductive silicide pillar(s) on the firstregion of the substrate.
 19. The method of forming an array of verticalfuse elements on a first region of a substrate adjacent to a secondregion of the substrate having fin field effect transistors of claim 18,further comprising: forming a blocking layer on the one or moreconductive silicide pillar(s) on the first region of the substrate;removing the remaining portion of the blocking layer from the secondregion of the substrate to expose the one or more vertical fins; andfabricating a fin field effect transistor from each of the one or morevertical fins on the second region of the substrate.
 20. The method offorming an array of vertical fuse elements on a first region of asubstrate adjacent to a second region of the substrate having fin fieldeffect transistors of claim 19, where the fin field effect transistor(s)on the second region of the substrate form a logic circuit, a memorycircuit, or a combination thereof, and at least one conductive silicidepillars is electrically coupled to the logic circuit, the memorycircuit, or the combination thereof.